FOUP
FOUP stands for "Front Opening Unified Pod" and is used to carry wafers around in a semiconductor factor, which is called a fab.
From Intel, "Front Opening Unified Pod is the specialized plastic container that carries the wafers from one process step to another in a controlled environment."
From Intel, "Front Opening Unified Pod is the specialized plastic container that carries the wafers from one process step to another in a controlled environment."
Has the FOUP of wafers been delivered to the tool yet? It is holding up the assembly line if it doesn't get here soon.
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